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KKG Electric Technology

Thickness 0.3 0.5 1 1.5 2mm Thermal Conductive Silicone Pad

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High Light: Thickness 0.3mm Thermal Conductive Silicone Pad, Thickness 0.5mm Thermal Conductive Silicone Pad, Thickness 1.5mm Heat Conductive Pad
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Estimated Delivery Date: Jan 27-Jan 27
Frequently Asked Questions
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Specifications


Product Specification


Thermal interface silicone material is high-performance,

thermal conductive gap filling materials.
Mainly for the transmission interface between the electronic equipment,

and heat sink or product outer coving.
With nice stickiness,flexibility,good compression performance and excellent

heat conductivity designed for it.
It makes the products can discharge gas from the electronic original and heat sink,

to achieve fully conforming and obvious cooling effect


Thermal conductive silicone pad' Feature


1. Low price with best quality,high thermal conductivity with low thermal resistance;

2. Natural stickiness, soft and flexible;

3. High electrical insulation can protect electronic devices;

4. Easy instalaction and easy use;

5. ROHS UL compliant


7. Modle of high thermal conductivity requirements;

8. New energy vehicles;

9. Microprocessors,memory chips and graphics processors;

10. Network communications equipment;

11. Car equipment and charger;

12. High-speed hard disk drive.


Company Profile


1.16-year Manufacturing for OEM/ODM experiences

2.2000+ square meters manufacturing plant;
3.5 Production lines with 120 workers;
4.A R&D team and a quality system team of 30;
5.ISO 9001. ISO 14001. IATF16949 certification;
6.One-stop supplier from Design,Printing and Die-cutting service.


FAQ


Q: what is your MOQ for this item?

A: MOQ is 100, but always flexible.

Q: Can I get some samples?
A: Sure, Sample order is available.

Q: what about lead time?
A: 7-10 days after deposit received.

Q: terms of payment?
A: Trade Assurance, T/T, credit card, western union, cash, Money Gram

Q: My item was damaged in shipping?
A: Our parts are carefully packaged to prevent damage in shipping.


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