Emi Conductive Fabric
${{shopModel.rebate>0?shopModel.discountPriceStr:shopModel.formattedAmount}}
$ {{shopModel.formattedAmount}}
Like
{{item.name}}
Quantity：
Estimated Delivery Date: Jan 27-Jan 27
Frequently Asked Questions
How can I contact customer service?
Do you ship overseas?
How long will it take to get my order?
Specifications
{{item.name}}
{{item.value}}
How EMI Conductive Fabric Works (Same as EMI Shielding Pads)
The essence of EMI shielding gaskets (including conductive fabric-based gaskets) lies in eliminating “electromagnetic leakage paths” by filling mechanical gaps in equipment enclosures—even minute gaps can act like “slot antennas” to radiate or receive interference signals, particularly in high-frequency scenarios like 5G where sensitivity to interference is heightened. Their shielding mechanism primarily achieves electromagnetic shielding through three methods:
1. Reflection Attenuation: The conductive components (metal particles, conductive coatings, conductive fabric plating, etc.) create high-impedance reflection against incident electromagnetic waves, preventing signal penetration through gaps.
2. Absorption Loss: Certain materials (e.g., conductive fabric fiber structures, foam substrates) dissipate electromagnetic energy as heat through their internal structures, demonstrating significant effectiveness against low-frequency interference.
3. Grounding and Current Dissipation: Establishes a low-resistance conductive path (conductive fabric coatings enhance dissipation efficiency), directing induced electromagnetic currents into the equipment's grounding system to eliminate interference accumulation.
The synergistic action of these three mechanisms enables the gasket to achieve stable shielding performance across different frequency ranges (typically measured in decibels, dB; higher values indicate stronger shielding effectiveness).
The performance of EMI shielding gaskets is determined by both the base material and conductive components. Different materials exhibit significant differences in their suitability for various applications. Common types and characteristics are shown in the table below (including conductive fabric gaskets that interface with EMI conductive fabric):
| Material Type | Core Structure | Key Characteristics | Advantages | Limitations | Typical Applications |
| Conductive Fabric Gasket | Nickel-Copper-Nickel Plated Conductive Fabric + Polyurethane Foam Core | Shielding effectiveness: 80-95dB (100KHz-3GHz), wear-resistant, excellent flexibility, integrated buffering function | Suitable for irregular gaps, easy installation, good anti-static (ESD) performance | Performance degrades in high-temperature environments (>125℃), limited load-bearing capacity | Laptop computers, mobile communication devices, seams of electronic enclosures |
| Conductive Foam Gasket | Polyurethane/Polyethylene Foam Substrate + Nickel-Copper/Conductive Particle Coating | Shielding effectiveness: 60-90dB (10MHz-10GHz), high compressibility, lightweight | Suitable for irregular gaps, light weight, moderate cost, easy to process and customize | Prone to aging after long-term compression, performance degrades in high-temperature environments | Consumer electronics (mobile phones, laptops), 5G base stations, IoT devices |
| Conductive Rubber Gasket | Silicone/Fluorosilicone Rubber Substrate + Silver-Aluminum/Silver-Nickel/Nickel-Graphite Conductive Filler | Temperature resistance: -40℃ to +125℃, corrosion-resistant, integrated sealing and shielding | Strong environmental adaptability, oil and solvent resistance, excellent flame retardancy (some meet UL94 V-0) | Relatively high weight, large compression force, higher cost than foam gaskets | Aerospace, automotive electronics (ECU), industrial control equipment |
| Metal-Based Gasket | Beryllium Copper Spring Fingers, Metal Braided Mesh, Metal Foil | Shielding effectiveness: >90dB, excellent conductivity, high mechanical strength | Strong stability, anti-aging, suitable for high-frequency and high-interference scenarios | Poor flexibility, easy to scratch enclosures, heavy weight, high cost | National defense equipment, radar devices, precision instruments |
| Form-In-Place (FIP) Gasket | Liquid Conductive Compound Cured by On-Site Dispensing | Seamless sealing, suitable for complex geometric structures, shielding effectiveness: >90dB | Eliminates assembly gaps, integrated molding, suitable for automated production | Requires special equipment, long R&D cycle, high cost for small batches | Avionics, medical equipment, customized precision instruments |
| Ultra-Thin AIR LOOP Gasket | Hollow Ring Structure + High-Conductivity Fabric (Conductive Fabric Derivative) + Conductive Adhesive | Thickness: 0.8-1.5mm, 20% weight reduction, wear resistance: >400,000 cycles | Suitable for ultra-thin devices, stable high-frequency shielding (85dB@30MHz-3GHz) | Limited load-bearing capacity, not suitable for high-pressure compression scenarios | 5G mobile phones, ultra-thin laptops, wearable devices |
CUSTOMER REVIEWS
{{commentStat.averageRating}}
{{commentStat.total}} Revirews
All({{commentStat.total}})
Images({{commentStat.imgSum}})
5 Star({{commentStat.praiseSum}})
{{item.comments}}